E22-M Series, LoRa Module E22-900M30S
E22-900M30S
[IC] : SX1262
[Frequency] : 850~930MHz
[Power] : 30dBm
[Distance] : 12km
[Interface] : SPI
[Weight] : 4.9±0.1g
[Introduction] : The E22 series is the first wireless module in China to adopt Semtech's SX1262, SX1268 RF chip. This chip provides a variety of modulation methods, such as LoRaTM and traditional GFSK. Its special LoRaTM modulation method increases the communication distance.
| Model | IC | Interface | Frequency Hz | Power dBm | Distance km | Air Rate(bps) | Package | Size (mm) | Feature | Manual |
| E22-400M22S | SX1268 | SPI | 433M 470M | 22 | 7 | 0.018~300k | SMD | 14*20 | Low consumption, anti-interference | ✔ |
| E22-400M30S | SX1268 | SPI | 433M 470M | 30 | 12 | 0.018~300k | SMD | 24*38.5 | Low consumption,anti-interference | ✔ |
| E22-900M22S | SX1262 | SPI | 868M 915M | 22 | 7 | 0.018~300k | SMD | 14*20 | Low consumption,anti-interference | ✔ |
| E22-900M30S | SX1262 | SPI | 868M 915M | 30 | 12 | 0.018~300k | SMD | 24*38.5 | Low consumption,anti-interference | ✔ |
| RF Parameter | Value |
Remark |
| Working frequency |
850~930 MHz |
- |
| Transmitting power | 30 dBm |
Max. Power (1W) |
| Receiving sensitivity |
-150 dBm |
- |
| Air data rate | 0.018k~300kbps |
- |
| Test distance | 12000m |
In open and clear air, with maximum power, 5dBi antenna gain, height of 2m |
| Hardware Parameter | Value |
Remark |
|
Size |
24 * 38.5 mm |
|
|
Antenna type |
IPEX / Stamp hole |
|
|
Communication interface |
SPI |
|
|
Package |
SMD |
|
| Electronic parameter | Min. | Typ. | Max. | Unit | Condition |
| Power supply |
2.5 | 5 | 5.5 | V | |
| Communication level | 1.8 | 3.3 | 3.7 | V | |
| Transmitting current |
600 | 650 | 700 | mA | 30dBm（1W） |
| Receiving current |
12 |
14 | 16 | mA |
|
| Sleep current |
1 |
3 | 5 | nA | |
| Operating temperature |
-40 | 20 |
+85 | ℃ | |
| Operating humidity |
10 | 60 |
90 | % | |
| Storage temperature |
-40 | 20 |
+125 | ℃ |
| Pin No. |
Pin Item | Pin Direction | Pin Application |
|
1 |
GND |
- |
Ground |
|
2 |
GND |
- |
Ground |
|
3 |
GND |
- |
Ground |
|
4 |
GND |
- |
Ground |
|
5 |
GND |
- |
Ground |
|
6 |
RXEN |
Input |
RF switch RX control，connecting external MCU IO, valid in high level |
|
7 |
TXEN |
Input |
RF switch TX control，connecting external MCU IO or DIO2, valid in high level |
|
8 |
NRST |
Input |
Module reset pin, low reset |
|
9 |
VCC |
- |
Power supply, 2.5V~5.5V（external ceramic filter capacitoris recommended） |
|
10 |
VCC |
- |
Power supply, 2.5V~5.5V（external ceramic filter capacitoris recommended） |
|
11 |
GND |
- |
Ground |
|
12 |
GND |
- |
Ground |
|
13 |
DIO1 |
Input/Output |
Configurable IO port（see more in SX1262 datasheet） |
|
14 |
BUSY |
Output |
State indicator（see more in SX1262 datasheet） |
|
15 |
NRST |
Input |
Chip reset initiation, valid in low level |
|
16 |
MISO |
Output |
SPI master input slave output |
|
17 |
MOSI |
Input |
SPI master output slave input |
|
18 |
SCK |
Input |
SPI clock |
|
19 |
NSS |
Input |
Chip select，for starting a SPI communication |
|
20 |
GND |
- |
Ground |
|
21 |
ANT |
- |
Stamp hole（50 ohm impedance） |
|
22 |
GND |
- |
Ground |
